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The Global Semiconductor Alliance (GSA) European Executive Forum (EEF) 2017 will take place on APR/04-05 in Munich, Germany. It is themed “Industries at a Crossroad: Digital Transformation” picking up the fact that...
The 13th Annual Device Packaging Conference (DPC 2017) is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge...
This year’s 5th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass...
The 18th Electronics Packaging Technology Conference (EPTC) takes place from NOV/30 – DEC/03, 2016, at Suntec Singapore Convention & Exhibition Center. EPTC is the IEEE CPMT Society’s Flagship Conference in...
The 13th International Wafer-Level Packaging Conference (IWLPC), an annual event organized by SMTA and Chip Scale Review, will take place from OCT/18-20, 2016, in San José, CA, USA. The program committee decided to focus on packaging and...
ECTC, San Diego, CA, USA, 2012, Las Vegas, NV, 2013 and Lake Buena Vista, FL, 2014
IWLPC, Santa Clara, CA, USA, 2011 and San José, CA, USA, 2012, 2013, 2014
SEMICON West, San Francisco, CA, USA, 2013, 2014
ENDIEL, Porto, Portugal, 2011
Electronica, Munich, Germany, 2012
ESTC, Amsterdam, The Netherlands, 2012
SEMI Brussels Forum, Brussels, Belgium, 2012
SEMICON Europa, Dresden, Germany, 2010, 2011, 2012, 2013 and Grenoble, France, 2014
SEMICON Russia, Moscow, Russia, 2011, 2012
NANIUM is active as member and co-chair of several conference committees.
Some of the events have been chaired or co-chaired by our engineers.
Pan Pacific Microelectronics Symposium, Hawaii, US, 2014 - "Multi-Die Embedding in Fan-Out WLP" (Steffen Kroehnert - NANIUM)
MicroTech 2014 – IMAPS UK Conference, Harwell, UK - "Advances in Fan-Out WLP Technology eWLB are Paving the Way for High Density System Integration in Thin WLP" (Steffen Kroehnert - NANIUM)
DATE 2014 – Design, Automation & Test in Europe, Dresden, Germany - "Semiconductor Packaging is back to Europe - Advances in System Integration in Wafer Level Packaging" (Steffen Kroehnert - NANIUM)
64th ECTC 2014, Lake Buena Vista, FL, USA - "Introduction of Enhanced Dielectric Material for Higher Reliability" (Vitor Henriques - NANIUM)
EPIC's workshop on Photonics Integration Circuits Packaging Standardization, ‘s-Hertogenbosch, The Netherlands - "Large Scale, High Volume Fan-Out Wafer Level Packaging and System Integration on Wafer Level for Electronics - Ready for Opto-Electronics too?" (Steffen Kroehnert - NANIUM)
Fraunhofer ENAS's Chemnitzer Seminar, Chemnitz, Germany - "Fan-out Wafer Level Packaging - Flexible Technology Platform for System Integration" (Steffen Kroehnert - NANIUM)
Semicon West 2014, San Francisco, CA, USA - Panel discussion: "Mobility and More –The M&Ms of Cost Beneficial Advanced Packaging" (António Barny, NANIUM)
5th ESTC 2014, Helsinki, Finland - "eWLB SiP with Sn finished passives" (Steffen Kroehnert - NANIUM)
Semicon Europa 2014 (SEMI), Grenoble, France, TechARENA
Semicon Europa 2014 (SEMI), Grenoble, France, Advanced Packaging Conference - "Leading Edge Embedding Technologies Combined: eWLB + ECP® = E2CP" (Steffen Kroehnert - NANIUM)
Semicon Europa 2014 (SEMI), Grenoble, France, Advanced Packaging Conference - Panel discussion: "Packaging in Europe - Future Opportunitites" (Armando Tavares - NANIUM)
4th Global Interposer Technology Workshop, Atlanta, GA, USA - "Multi-component WLFO interposers" (Steffen Kroehnert - NANIUM)
3D Architectures for Semiconductor Integration and Packaging, Burlingame, CA, USA - "The Next Generation Fan-Out WLP Technology eWLB – High Density WLSiP" (Steffen Kroehnert - NANIUM)
SEMICON West 2013 - "Enabling of Thin Package by Fan-Out WLP" (José Campos - NANIUM)
DASS 2012 (FhG IIS EAS), Dresden, Germany, Conference Keynote: "Innovative Packaging Technologies and System Integration – Challenges to Design Volume Products" (Steffen Kroehnert, Abel Janeiro)
62nd ECTC 2012 (IEEE-CPMT), San Diego, CA, USA, Conference Paper: “Development of Early Process Control Indicators for Reliability Drop Test Performance of eWLB Products” (Jorge Teixeira, Alexandre Azevedo, Oriza Tavares, Rui Marques)
45th International Symposium on Microelectronics 2012 (IMAPS), San Diego, CA, USA, Conference Paper: “Systematic Feedback Loop for Silicon Die Pick&Place Process in Reconstituted Fan-out eWLB Wafers in High Volume Production” (Nelson Pinho, Alberto Martins – NANIUM; Harald Meixner – DATACON)
45th International Symposium on Microelectronics 2012 (IMAPS), San Diego, CA, USA, Conference Paper: “Method to measure wafer stiffness in Fan-Out Wafer Level Package" (Jorge Teixeira)
4th ESTC 2012 (IEEE-CPMT), Amsterdam, The Netherlands, Conference Paper & Panelist: “Fan-Out WLP - The Enabler for System-in-Package on Wafer Level (WLSiP)" (Steffen Kroehnert, Jose Campos, Eoin O'Toole)
Semicon Europa 2012 (SEMI), Dresden, Germany, TechARENA: “System-in-Package (SiP) on Wafer Level, Enabled by Fan-Out WLP (eWLB)" (Steffen Kroehnert)
Semicon Europa 2012 (SEMI), Dresden, Germany, Advanced Packaging Conference: “Reliability, Processability, and Yield in 2Layer RDL eWLB Packaging” (Eoin O’Toole)
9th IWLPC 2012 (SMTA), San José, CA, USA, Conference Paper: “Developments of Fan-out Wafer Level Packaging Technology for System-in-Package on wafer-level (WLSiP)" (José Campos, Eoin O’Toole, Vitor Henrique, Alberto Martins, Ana Leão, André Cardoso, Abel Janeiro)
9th International Conference and Exhibition on Device Packaging (IMAPS), Scottsdale/Fountain Hills, AZ, USA, Conference Paper: “Spheron WLCSP Technology Qualification and Scale Up from 200mm to 300mm" (André Cardoso, Rui Almeida, Felandorio Fernandes – NANIUM; Anthony Curtis, Theodore Tessier – FCI)
MiNaPAD 2011 (IMAPS), Grenoble, France, Conference Paper: “Lithography Challenges of 300mm Reconstituted Wafers" (Nuno Silva, Eoin O’Toole)
61st ECTC 2011 (IEEE-CPMT), Orlando, Lake Buena Vista, FL, USA, Conference Paper: "Lithography Technique to Reduce the Alignment Errors from Die Placement in Fan-Out Wafer Level Packaging Applications" (Warren W. Flack, Robert Hsieh, Gareth O. Kenyon, Khiem Nguyen, Manish Ranjan - Ultratech; Rainer Leuschner, Werner Robl, Thorsten Meyer - Infineon; Nuno Silva, Paulo Cardoso, Eoin O'Toole - NANIUM)
CATRENE DTC / eda Workshop 2011, Dresden, Germany, Panel: “More than Moore – The Most Important Driver of Microelectronics! Or?“ (Steffen Kroehnert)
Semicon Europa 2011 (SEMI), Dresden, Germany, TechARENA: “More than Moore” – Heterogeneous Integration on Wafer Level, enabled by fan-out WLP" (Steffen Kroehnert)
Semicon Europa 2011 (SEMI), Dresden, Germany, TechARENA: “From IDM to OSAT - Test Challenges and Opportunities" (Conceicao Caldeira)
Semicon Europa 2011 (SEMI), Dresden, Germany, Advanced Packaging Conference: "High-Speed Multi-Die DRAM Packages Fabricated Using Wire-Bond Infrastructure" (Simon McElrea –Tessera; Luis Mendes, Rui Pedro Silva - NANIUM)
8th IWLPC 2011 (SMTA), Santa Clara, CA, USA, Conference Paper: “New Applications for Fan-Out Wafer Level Packaging Technology" (José Campos)
Semicon Europa 2010 (SEMI), Dresden, Germany, TechARENA: “Increasing Importance of Chip-Package Co-Design in Times if IDM Disintegration" (Steffen Kroehnert, Antonio Barny)
Semicon Europa 2010 (SEMI), Dresden, Germany, TechARENA: "Single Component Traceability for Reconstructed Wafer eWLB Automation Concept" (Paulo Gouveia)
Semicon Europa 2010 (SEMI), Dresden, Germany, TechARENA: “NANIUM - The Package Design, Assembly & Test Engineering and Manufacturing Center in Europe" (Steffen Kroehnert, Antonio Barny)
Semicon Europa 2010 (SEMI), Dresden, Germany, Advanced Packaging Conference: “Mechanical Deformation Effects in 300mm Reconstructed eWLB Wafers” (Eoin O’Toole)