MEMBERSHIPS & PARTNERS

Leading the way in semiconductor packaging, test and engineering services

SEMI

Semiconductor Equipment and Materials International (SEMI) is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. NANIUM is co-chairing the organizational committee of the SEMI Europe “Advanced Packaging Conference (APC)”, taking place at annual Semicon Europa show. NANIUM also participates in SEMI’s Member Advocacy programs.

 

 

EECA-ESIA

European Semiconductor Industry Association (ESIA) represents semiconductor-manufacturing companies operating in Europe – either directly or through the membership of national associations. Through this mixed membership model, the semiconductor industry speaks with one voice in Europe.

 

 

Through individual memberships of our employees, NANIUM also participates in key industry groups, including: 

 

IEEE CPMT

We are active in the Components, Packaging and Manufacturing Technology Society (CPMT) of the Institute of Electrical and Electronics Engineers (IEEE)). NANIUM supports the annual premier packaging event in the U.S., the “Electronic Components and Technology Conference (ECTC)”, and its European-branch “Electronics System Integration Technology Conferences (ESTC)”, where NANIUM is active in the technical committee.

 

 

SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic-assembly technologies, including microsystems, emerging technologies, and related business operations. SMTA organizes and hosts the annual International Wafer Level Packaging Conference (IWLPC), which is supported by NANIUM.

 

 

IMAPS

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. NANIUM experts are active in the technical committee of “European Microelectronics Packaging Conference (EMPC)”.

 

 

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We also partner with major universities, research institutes, IP providers and technology organizations to stay abreast of the latest R&D developments that help us meet the rapidly changing technical demands that our customers face. These include:

 

Portuguese Universities: University of Porto (FEUP), University of Minho, University of Aveiro, University Nova de Lisboa (FCT), ISEP, EGP-UPBS and IST (Internship protocols and co-operation in several areas)

 

The International Nanotechnology Laboratory (INL), a research organization for nanoscience and nanotechnology supported by the governments of Portugal and Spain, based in Braga, Portugal.

 

Fraunhofer Institutes: FhG IZM, Berlin, Germany, with IZM-ASSID, Dresden, Germany, FhG ENAS, Chemnitz, Germany and Fraunhofer Portugal.

 

Intel, develops and markets innovative semiconductor products and solutions for mobile communications (Technology Licence, Development Partnership)