- WHY CHOOSE NANIUM
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Get acquainted with our services
We offer Wafer-Level Fan-Out (WLFO) embedded packaging technology, which allow for dense heterogeneous integration, high-performance,smaller form-factor, and thinner package solutions.
Meet our in-house capabilities for high-volume manufacturing (HVM) handling and processing of 300mm wafers.
More-than-Moore complex heterogeneous integration based on Wafer-Level packaging
We ensure best-in-class industry quality, reliability and yield by having an in-house, fully equipped laboratory at our service
Articles, reports and flyers we have issued over the years
Temporary Wafer Carrier solutions for thin FOWLP and eWLB-based PoP
NANIUM & MARVELL join article published at CSR magazine in Nov-Dec 2015
As a leader in Wafer-Level Packaging (WLP) solutions, NANIUM plays an active role in working towards sustainability
Discover more on our presence at several events in the semiconductor industry