NANIUM has state-of-the-art testing equipment capable of delivering high end and cost – efficient test solutions and manufacturing services:

• Wafer Test, Laser Repair, Automatic Inspection Systems
• 200mm / 300mm wafer testing with bitmap and flexible prober type
• High parallelism and high accuracy probers, wide temperature range (-10ºC~150ºC)
• Fully automated optical inspection

• Burn In equipment for SDRAM
• Test During Burn In and monitoring Burn In
• High throughput load / unload in parallel, 100% Burn In for high volume
• Loader toolkit and Burn In Boards development

• Test equipment for SDRAM up to GDDR5
• High speed testing capability / Test solutions development
• High throughput / high volume equipment, 100% test for high volume
• Testing temperature range capability from low to high temp

• High throughput package inspection, laser marking & marking pattern inspection
• Output management for Tape or Tray media

NANIUM complements the manufacturing services with dedicated Product Engineering and Application Test teams for Burn In and Final Test. Furthermore, we provide development support for Burn In & Test programs, High Speed Test solutions, Reliability Programs, Tooling, Test Development for productivity improvement, Yield Engineering and TTR.