- WHY CHOOSE NANIUM
- OUR SERVICES
- MEDIA & EVENTS
We offer a range of solutions for wafer probing, mapping and characterization of either customer owned or manufacturer supplied products.
Leveraging our experience at partnering with fabs and development centers around the world within a multi-national IDM, NANIUM provides test development and manufacturing services in-house or at third-party locations. Our state-of-the-art clean room facilities have complete test-flow equipment for advanced memory products. We provide services ranging from 200/300mm wafer test, through burn-in and final test, to mark, scan and pack.
Backed by our world-class IT infrastructure, NANIUM’S experts implement data-processing tasks of varying complexity levels, such as reporting, advanced real-time adaptive test, post processing of test data, automatic lot disposition and equipment monitoring.
Our product engineering team has broad and deep expertise in yield and test optimization for projects ranging from low to high volume, starting with product qualification and extending to mass production.
In addition, we offer a wide range of reliability programs. These include volume production burn-in with in-situ fail-rate monitoring and co-development of early fail study, early life test and high-temperature operating life monitoring plans. Our highly sophisticated ovens support parallel test during burn-in, which allows extremely accurate reliability assessment.
Our customized test solutions cover the complete product lifecycle, from consulting on test strategy definition to production test. NANIUM’s Test Engineering Team has highly skilled engineers with over 15 years of experience at leading semiconductor IDMs. We have extensive experience working in international multi-cultural teams, and are fully committed to our customers’ IP protection.
Our customized test solutions cover the complete product lifecycle, from consulting on test strategy definition to production test. We partner with our customers to develop strong solutions for prototype tests, and to support the industrialization and qualification of their products through ramp up and volume production.
Our engineers help clients define test and burn-in requirements and ensure manufacturability – always keeping a focus on costs and time to market.
We also develop customized solutions for wafer, component/module, or application test, in a vast product range that includes MCM, MCP and SiP. We have proven know-how in high-speed test, built on DRAM experience with all generations up to GDDR5.
NANIUM’s Test Engineering Team also develops test and burn-in programs for characterization and production, as well as test fixtures, sockets, probe cards and handler tool-kits.